Корпуса микросхем по стандарту JEDEC
STEP модели по стандарту JEDEC, JEDEC STEP Models
MS-001-D
Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S
| Внешний вид | Модель | JEDEC Name | Description |
|
MS-001.AA DIP14 |
MS-001.AA | DIP14 |
|
MS-001.AB (DIP16) |
MS-001.AB | DIP16 |
|
MS-001.AC (DIP18) |
MS-001.AC | DIP18 |
|
MS-001.AD (DIP20) |
MS-001.AD | DIP20 |
|
MS-001.AE (DIP22) |
MS-001.AE | DIP22 |
|
MS-001.AF (DIP24) |
MS-001.AF | DIP24 |
|
MS-001.AG (DIP28) |
MS-001.AG | DIP28 |
|
MS-001.BA (DIP8) |
MS-001.BA | DIP8 |
|
MS-001.BB (DIP16) |
MS-001.BB | DIP16 |
|
MS-001.BC (DIP18) |
MS-001.BC | DIP18 |
|
MS-001.BD (DIP22) |
MS-001.BD | DIP22 |
|
MS-001.BE (DIP24) |
MS-001.BE | DIP24 |
|
MS-001.BF (DIP28) |
MS-001.BF | DIP28 |
MS-012F
Standard - Plastic Small Outline (SO) Family Peripheral Terminals, 1.27 mm Pitch, 3.90 mm Body Width (Mold Flash and End Protrusion). R-PDSO/SOP/SOIC. Item 11.11-801(s)
| Внешний вид | Модель | JEDEC Name | Description |
|
MS-012.AA (SO8) |
MS-012.AA | SO8 |
|
MS-012.AB (SO14) |
MS-012.AB | SO14 |
|
MS-012.AC (SO16) |
MS-012.AC | SO16 |
|
MS-012.BA (SO8) |
MS-012.BA | SO8 with Thermal Pad |
|
MS-012.BB (SO14) |
MS-012.BB | SO14 with Thermal Pad |
|
MS-012.BC (SO16) |
MS-012.BC | SO16 with Thermal Pad |